TECu1-12710 Thermoelectric Peltier Chip Module Copper Substrate
TEC1-12715 - Superior efficiency & performance compared to 12705
(if used correctly)
This is a specialized Peltier module with two unique features:
- Maximum attainable heat transfer with ultra thin copper plates instead of the traditional ceramic plates.
- Ultra thin 1.92mm overall module thickness compared to 3.2 - 3.9mm that is typical for 40*40mm modules.
- Even heat dissipation across the entire surface.
- Recommended for applications that need the most power and fastest thermal response in a compact package.
This module must be handled very carefully. Because copper is a soft metal, be careful to not damage it, if bent, the module will fail.
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